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MicroAutoBox II

紧凑坚固的实车应用原型开发系统

MicroAutoBox II 是一款用于执行快速功能原型开发的实时系统。与 ECU 相似,该系统可以在无需用户干预的情况下运行。

  • MicroAutoBox Embedded DSU (Data Storage Unit)

    MicroAutoBox Embedded PC具有第六代Intel® Core™ i7处理器、16GB RAM和128GB闪存,并包括外部SATA接口(4x SATA 3.0)。该接口帮助记录大量数据,例如,来自摄像头传感器、雷达传感器和激光雷达传感器的数据,并能够捕获具有高带宽的数据。为此, dSPACE现推出 MicroAutoBox Embedded DSU (Data Storage Unit)),其带有四个SSD和几个兆字节的内存。

    详细了解

  • MicroAutoBox Embedded PC新变体

    dSPACE现又推出了MicroAutoBox Embedded PC新变体,其功能更加强大。由于具有第六代四核Intel® Core™ i7处理器、16 GB RAM和128 GB闪存,它为复杂的、计算密集型车载原型开发应用程序提供了更多动力,例如:开发高级驾驶辅助系统和自动驾驶功能。

    详细了解

  • MicroAutoBox II 的全新安全机制

    为了在功能开发和实车测试的过程中达到更高的安全水准,MicroAutoBox II开发系统推出了监控机制 ,这些功能同样应用于 批量生产 。它们包括多级看门狗、集成式挑战应答机制、各种内存完整性检查以及电源电压监控。

    详细了解

  • 纯电动跑车

    Rimac Automobili Concept_One 经过彻底改装设计,成为首辆全电动跑车。无所动容?认为 1088 hp 和 4 个独立的电动机如何?这一切动力始终由 MicroAutoBox 实施检测。

    详细了解

  • 无人驾驶

    由于智能驾驶技术的开发不断取得进展,自主驾驶车辆加入日常道路交通已指日可待。借助 dSPACE MicroAutoBox,中国同济大学汽车研究院的一组研究人员开发出一款电动原型汽车,目前已经可以在这所大学的校园内自主驾驶。

    详细了解

  • 腾飞的 HOMER

    在 HOMER (HOver ManoEuvRe) 项目中,空中客车防务及航天公司开发出一种创新的二合一原型,用于控制未来航天器的着陆和悬飞操纵。航天器上搭载了两个 dSPACE MicroAutoBox 平台来控制试飞。

    详细了解

应用领域

MicroAutoBox II 可用于多种快速控制原型开发应用,例如动力传动系统、车身控制、高级驾驶辅助系统、x-by-wire 应用以及航空航天应用。
 

主要优点

MicroAutoBox II 的独特优势在于它将强大的性能、全面的汽车 I/O 、极其紧凑而强大的设计(符合 ISO 16750-3:2007 极端冲击与振动测试)集于一身。这让您可以配备多辆车或整个测试车队来检查控制功能的可靠性。除了标准 I/O 之外,某些配置版本的 MicroAutoBox II 还带有 FPGA 功能,用以满足特定应用的 I/O 扩展及用户可编程的 FPGA 应用。此外,某些MicroAutoBox变体配备的接口可以满足所有主流汽车总线系统的需要:CAN、CAN FD、LIN、K/L-Line、FlexRay 和以太网。还可以选用一台辅助嵌入式电脑,将其集成在 MicroAutoBox II 中。

新增功能

MicroAutoBox II可以在通电后自动启动,拥有与 ECU 类似的引导时间。易于连接个人电脑或笔记本电脑来下载应用程序、对模型参数化以及通过以太网进行数据分析。应用程序存储在非易失性存储器中。MicroAutoBox II 具有汽车信号级信号调节功能以及一个用于长期采集数据的集成式飞行记录器(包括支持 USB 大容量存储器)。

五种不同的标准配置版本
MicroAutoBox II共有五种标准变体,分别配备了不同的接口和 I/O 功能。RapidPro 硬件配备了现成信号调理和功率级模块,是MicroAutoBox II的理想扩展。所有的标准系列都能集成一台辅助嵌入式电脑。

 

Parameter Specification
MicroAutoBox II 1401/1507 1401/1511 1401/1513 1401/1511/1514 1401/1513/1514
Processor
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
Memory
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
Boot time
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
Interfaces          

Host interface

  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools

Ethernet real-time I/O interface

  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector

USB interface

  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector

CAN interface

  • 4 CAN channels
  • 4 CAN channels
  • 6 CAN channels (partial networking supported)
  • 4 CAN channels
  • 6 CAN channels (partial networking supported)

Serial interface (based on CAN processor)

  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 3 x RS232 interface
  • 3 x serial interface usable as K/L-Line or LIN interface
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 3 x RS232 interface
  • 3 x serial interface usable as K/L-Line or LIN interface

ECU interface

  • 3 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface

IP module slot for FlexRay/CAN FD

  • 2 slots1) for FlexRay2) or CAN FD modules
  • 2 slots1) for FlexRay2) or CAN FD modules
  • 2 slots1) for FlexRay2) or CAN FD modules
Programmable FPGA
  • Xilinx® Kintex®-7 (XC7K325T)
  • Xilinx® Kintex®-7 (XC7K325T)
Analog input          

Resolution

  • 16 16-bit channels
  • 32 16-bit channels
  • 16 16-bit channels3)
  • 32 16-bit channels3)

Sampling

  • 16 parallel channels with 1 Msps conversion rate
  • 16 independent AD converters with 1 Msps conversion rate and high functionality (diverse trigger options, burst mode, etc. for every channel)
  • 2 independent AD converters with 8 separate sample & hold input channels each. Time synchronous sampling of all 16 channels with 200 Ksps conversion rate in free-running mode.

  • 16 parallel channels with 1 Msps conversion rate
  • 16 independent AD converters with 1 Msps conversion rate and high functionality (diverse trigger options, burst mode, etc. for every channel)
  • 2 independent AD converters with 8 separate sample & hold input channels each. Time synchronous sampling of all 16 channels with 200 Ksps conversion rate in free-running mode.

Input voltage range

  • 0 ... 5 V
  • -10 ... 10 V
  • 0 ... 5 V
  • -10 ... 10 V
Analog output          

Resolution

  • 4 12-bit channels
  • 8 16-bit channels
  • 4 12-bit channels3)
  • 8 16-bit channels3)

Output voltage range

  • 0 ... 4.5 V
  • -10 ... 10 V
  • 0 ... 4.5 V
  • -10 ... 10 V

Output current

  • 5 mA max.
  • 8 mA max.
  • 5 mA max.
  • 8 mA max.
Digital I/O          

General

4)
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements

Bit I/O

4)
  • 40 inputs
  • 40 outputs, 5 mA output current
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 24 inputs
  • 24 outputs, 5 mA output current
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable

  • 40 inputs3)
  • 40 outputs, 5 mA output current3)
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 24 inputs3)
  • 24 outputs, 5 mA output current3)
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable

PWM generation / measurement

  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
Incremental Encoder interfaces
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
Onboard sensors
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
Signal conditioning
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
Physical connections          
LEMO connectors
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
Ethernet
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
Additional connectors
  • 78-pin Sub-D connector
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
Physical characteristics          
Enclosure Material
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
Size
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 95 mm (7.9 x 8.9 x 3.8 in)
  • Approx. 200 x 225 x 95 mm (7.9 x 8.9 x 3.8 in)
Temperature
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
Power supply
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
Power consumption
  • Max. 25 W
  • Max. 25 W
  • Max. 25 W
  • Max. 50 W
  • Max. 50 W

 

1) IP 模块槽。还可用于其他 IP 模块,例如 ARINC 接口模块(通过 dSPACE 工程服务)。
2) 例如,4 个 FlexRay 通道,可与 CAN FD 组合。
3) 附加的通道,带有 DS1552、DS1553和DS1554.
4) 通过 IP 模块槽上的 I/O 扩展(5 路输入和 2 路输出,或者 2 路输入和 5 路输出,软件可选,5 V 输出电位,24 mA 输出电流)提供额外的数字 I/O 通道。

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