DS6602 FPGA Base Board

SCALEXIO I/O boards with the latest Xilinx® FPGA technology

The DS6602 FPGA Base Board, one of the two high-performance FPGA boards from dSPACE, is equipped with the latest FPGA technology to meet the strictest requirements in a wide range of applications, such as electric drive technology, hybrid vehicles, power electronics, and electric power engineering. 

Application Areas

The DS6602 FPGA Base Board has been designed for applications that require very fast, high-resolution signal processing, for example:

  • Electric vehicle applications
  • Industrial drive applications
  • Electric power industry applications
  • Electric drive simulation
  • Power electronics simulation
  • Power hardware-in-the-loop simulation
  • Electric motor control development
  • Power electronics control development

With its very large and powerful FPGA, the DS6602 is the perfect candidate for hardware-in-the-loop (HIL) testing, which usually involves large simulation models.

Key Benefits

The DS6602 is the new high-end FPGA board from dSPACE. It is equipped with the largest FPGA of the latest Xilinx® Kintex® UltraScale+TM FPGA generation. Its additional onboard RAM allows for storage of very large datasets, e.g., model parameter sets required for advanced electric drives simulation. The DS6602 features four multi-gigabit transceivers (MGT) that enable high-speed communication. To include more I/O channels, you can connect up to five I/O modules to each board. Additionally, you can connect multiple boards via inter-FPGA communication for direct data exchange between FPGA stacks.

Programming the FPGA

Applications for the DS6602 FPGA are modeled with the AMD® Vitis TM Model Composer HDL Library, RTI FPGA Programming Blockset and the related dSPACE XSG-based solutions. If required, you can react flexibly to new requirements, such as new interfaces or having to accelerate the execution of submodels. You can also test the program in offline simulation before implementing it on the real-time hardware. Using dSPACE ConfigurationDesk, you can download the programs to the FPGA.

I/O Modules

Two I/O modules are available to expand the I/O channels of the dSPACE FPGA base boards: the DS2655M1 Multi-I/O Module and the DS2655M2 Digital I/O Module. Up to five I/O modules can be connected to each FPGA base board, thus providing a flexible, customized channel set.

Parameter DS6602
  • User-programmable FPGA board
  • Xilinx® Kintex® UltraScale+TM KU15P
    • System logic cells: 1,143,000 (DSP slices: 1968)
    • Distributed RAM: 9,800 kbit
    • Block RAM: 34,600 kbit
    • Ultra RAM: 36,000 kbit
Additional onboard RAM
  • 4 GB
Angular Processing Units (APUs)
  • Up to 6 as master or slave
Number of connectors for I/O modules
  • 5 connectors for standard I/O modules
  • 1 connector with 4 multi-gigabit transceivers (MGTs)
Device timing
  • 125 MHz
Internal communication interface
Physical size
  • 238 x 100 x 39 mm (9.4 x 3.9 x 1.5 in)
  • Requires 2 slots plus one additional slot for each I/O module
Voltage supply
  • 24 V
Typical power consumption
  • 75 W

  • SCALEXIO Informations produit, PDF, Anglais, 16194 KB

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