The DS6601 FPGA Base Board, one of the two high-performance FPGA boards from dSPACE, is equipped with the latest FPGA technology to meet the strictest requirements in a wide range of applications, such as electric drive technology, hybrid vehicles, power electronics, and electric power engineering.
The DS6601 FPGA Base Boardhase been designed for applications that require very fast, high-resolution signal processing, for example:
The DS6601offers a small, but powerful FPGA making it well-suited for applications that involve protocols, third-party interfaces, processor-based electric drive simulation, or developing electric drive and power electronic controllers in the context of rapid control prototyping (RCP). The DS6601 is the cost-effective alternative to the DS6602.
The DS6601 is the successor of the DS2655 FPGA Base Board (7K160 version) and includes a newer and approximately two times larger FPGA. The DS6601 features four multi-gigabit transceivers (MGT) that enable high-speed communication. To include more I/O channels, you can connect up to five I/O modules to each board. Additionally, you can connect multiple boards via inter-FPGA communication for direct data exchange between FPGA stacks.
Applications for the DS6601 FPGA are modeled with the Xilinx® System Generator, RTI FPGA Programming Blockset and the related dSPACE XSG-based solutions. If required, you can react flexibly to new requirements, such as new interfaces or having to accelerate the execution of submodels. You can also test the program in offline simulation before implementing it on the real-time hardware. Using dSPACE ConfigurationDesk, you can download the programs to the FPGA.
Two I/O modules are available to expand the I/O channels of the dSPACE FPGA base boards: the DS2655M1 Multi-I/O Module and the DS2655M2 Digital I/O Module. Up to five I/O modules can be connected to each FPGA base board, thus providing a flexible, customized channel set.
Parameter | DS6601 |
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General |
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FPGA |
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Additional onboard RAM | – |
Angular Processing Units (APUs) |
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Number of connectors for I/O modules |
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Device timing |
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Internal communication interface |
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Physical size |
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Voltage supply |
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Typical power consumption |
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