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MicroAutoBox II

Compact and robust prototyping system for in-vehicle applications

MicroAutoBox II is a real-time system for performing fast function prototyping. It can operate without user intervention, just like an ECU.

  • New DS1554 Engine Control I/O Module

    For MicroAutoBox variants with a DS1514 FPGA Base Board, dSPACE now offers the DS1554 Engine Control I/O Module that upgrades the compact in-vehicle prototyping unit to an even more powerful system for addressing the most complex tasks in advanced combustion engine control.

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  • More FPGA Performance for MicroAutoBox II

    In Release 2015-A, dSPACE adds an integrated FPGA board to round off its portfolio for the prototyping hardware, MicroAutoBox II, with new variants. The new variants, 1401/1511/1514 and 1401/1513/1514, are freely programmable and have a very powerful Xilinx® Kintex®-7 FPGA board (XC7K325T) that can solve even the toughest prototyping tasks.

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  • Successful robustness tests for aerospace applications

    Many development tasks in the field of aerospace engineering demand the applied hardware to be highly insensitive to height, temperature, and mechanical influences (vibration, impact), and to sources of electromagnetic disturbances. To confirm that dSPACE MicroAutoBox II is qualified for such scenarios, it was put through various tests in accordance with DO-160.

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  • Completely Electric Supercar

    The Rimac Automobili Concept_One was designed from the ground up to be a fully electric supercar – the first of its kind. Not impressed? How does 1088 hp and 4 independent electric motors sound? All this power is kept in check by a MicroAutoBox.

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  • No Driver Required

    Thanks to advances in the development of intelligent drive technology, the time is coming closer when self-driving vehicles will be a part of everyday road traffic. With the help of dSPACE MicroAutoBox, a group of researchers at the School of Automotive Studies, Tongji University, China, developed an electric prototype vehicle that can already drive by itself on the university campus.

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  • HOMER Takes Off

    With HOMER (HOver ManoEuvRe), Airbus Defence and Space had developed an innovative two-in-one prototype for future space vehicles that masters both landing and hovering maneuvers. Two dSPACE MicroAutoBoxes were on board to control the test flights.

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Application Areas

MicroAutoBox can be used for many different rapid control prototyping (RCP) applications such as:
  • Powertrain
  • Chassis control
  • Body control
  • Advanced driver assistance systems (ADAS)
  • Electric drives control
  • X-by-wire applications
  • Aerospace applications
     

Key Benefits

The special strength of the MicroAutoBox hardware is its unique combination of high performance, comprehensive auto­motive I/O, and an extremely compact and robust design (extreme shock and vibration tests according to ISO 16750-3:2007) – all for a favorable price. This lets you equip several vehicles or a whole test fleet to check the reliability of your control functions. With dSPACE's combination of comprehensive software and hardware support, you can also keep overall system costs low. In addition to the standard I/O, MicroAutoBox offers variants with FPGA functionality for application-specific I/O extensions and for user-programmable FPGA applications. Moreover, there are MicroAutoBox variants with inter­faces for all major auto­motive bus systems: CAN, CAN FD, LIN, K/L-Line, FlexRay, and Ethernet. As an option, an additional Embedded PC can be integrated into the MicroAutoBox II.


More Features

MicroAutoBox can start up autonomously after power-up, with ECU-like boot-up times. A PC or notebook can be easily connected (hot-plugged) for application download, model parameterization, and data analysis via Ethernet. Application programs are stored in nonvolatile memory. MicroAutoBox contains signal conditioning for automotive signal levels and an integrated flight recorder for long-term data acquisition (incl. support of USB mass storage devices).

Five Standard Variants
MicroAutoBox is available in five standard variants, each with different interfaces and I/O functionalities. An ideal extension for the MicroAutoBox is the RapidPro hardware with its off-the-shelf signal conditioning and power stage modules. All standard variants can integrate an additional Embedded PC. 

Parameter Specification
MicroAutoBox II 1401/1507 1401/1511 1401/1513 1401/1511/1514 1401/1513/1514
Processor
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
Memory
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB novolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB novolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB novolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB novolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB novolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
Boot time
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
Interfaces          

Host interface

  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools

Ethernet real-time I/O interface

  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector

USB interface

  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector

CAN interface

  • 4 CAN channels
  • 4 CAN channels
  • 6 CAN channels (partial networking supported)
  • 4 CAN channels
  • 6 CAN channels (partial networking supported)

Serial interface (based on CAN processor)

  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 3 x RS232 interface
  • 3 x serial interface usable as K/L-Line or LIN interface
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 3 x RS232 interface
  • 3 x serial interface usable as K/L-Line or LIN interface

ECU interface

  • 3 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface

IP module slot for FlexRay/CAN FD

  • 2 slots1) for FlexRay2) or CAN FD modules
  • 2 slots1) for FlexRay2) or CAN FD modules
  • 2 slots1) for FlexRay2) or CAN FD modules
Programmable FPGA
  • Xilinx® Kintex®-7 (XC7K325T)
  • Xilinx® Kintex®-7 (XC7K325T)
Analog input          

Resolution

  • 16 16-bit channels
  • 32 16-bit channels
  • 16 16-bit channels3)
  • 32 16-bit channels3)

Sampling

  • 16 parallel channels with 1 Msps conversion rate
  • 16 parallel channels with 1 Msps conversion rate
  • 16 multiplexed channels with 200 Ksps conversion rate
  • 16 parallel channels with 1 Msps conversion rate
  • 16 parallel channels with 1 Msps conversion rate
  • 16 multiplexed channels with 200 Ksps conversion rate

Input voltage range

  • 0 ... 5 V
  • -10 ... 10 V
  • 0 ... 5 V
  • -10 ... 10 V
Analog output          

Resolution

  • 4 12-bit channels
  • 8 16-bit channels
  • 4 12-bit channels3)
  • 8 16-bit channels3)

Output voltage range

  • 0 ... 4.5 V
  • -10 ... 10 V
  • 0 ... 4.5 V
  • -10 ... 10 V

Output current

  • 5 mA max.
  • 8 mA max.
  • 5 mA max.
  • 8 mA max.
Digital I/O          

General

4)
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements

Bit I/O

4)
  • 40 inputs
  • 40 outputs, 5 mA output current
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 24 inputs
  • 24 outputs, 5 mA output current
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable

  • 40 inputs3)
  • 40 outputs, 5 mA output current3)
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 24 inputs3)
  • 24 outputs, 5 mA output current3)
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable

PWM generation / measurement

  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
Incremental Encoder interfaces
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
Onboard sensors
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
Signal conditioning
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
Physical connections          
LEMO connectors
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
Ethernet
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
Additional connectors
  • 78-pin Sub-D connector
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
Physical characteristics          
Enclosure Material
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
Size
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 95 mm (7.9 x 8.9 x 3.8 in)
  • Approx. 200 x 225 x 95 mm (7.9 x 8.9 x 3.8 in)
Temperature
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
Power supply
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
Power consumption
  • Max. 25 W
  • Max. 25 W
  • Max. 25 W
  • Max. 50 W
  • Max. 50 W

 

1) IP module slot. Can also be used for other IP modules such as ARINC interface modules (via dSPACE Engineering Services).
2) i.e., 4 FlexRay channels, combination with CAN FD possible.
3) Additional channels with DS1552, DS1553, and DS1554.
4) Additional digital I/O channels available via I/O extension on IP module slot (5 inputs and 2 outputs, or 2 inputs and 5 outputs, software-selectable, 5 V output level, 24 mA output current).

Further Information Support